Technology File and Layer Stackup

In order to trace through the various conductor layers (and down into the active layers if you have those options licensed) the client needs to create a technology file -- which contains at a minimum the stackup table.

This can be done either via API calls or can be done by creating a file and loading the technology file. Files are useful since the same technology file can be applied to many layout files if they share the same fab or technology.

Consider the following device cross section. We've assigned some arbitrary GDSII layer numbers for the purposes of the example.

device crossection by process layer and GDSII layer

Stackup Block

The format is:

METAL                            
# Order Layer  Name    Type
   1      17   POLY       P
   2       8   CONTACT    C
   3      19   M1         M
   4      20   VIA12      V
   5      21   M2         M
   6      22   VIA23      V
   7      31   M3         M
   8      35   VIA34      V
   9      34   M4         M
ENDMETAL

keyword METAL indicates start of conductor stackup
comment has first character in line #
poly is considered the first "conductor" layer
contact is placed between poly and M1
 
 
 
 
 
 
 
keyword ENDMETAL to end the conductor stackup

Synthesize Block

This optional block is used when one needs to combine GDSII layers with some sort of a Boolean operation. For syntax and usage detailes see: Derived Layers.

SYNTHESIZE
#Derived_Layer_Tag Operation
0017 17:20 - 17:30
ENDSYNTHESIZE

Driver Detection Block

This optional block is needed when the user wants to obtain Driver Coordinate Points.

DRIVER_INFO
METAL 16:0
CONTACT 15:0
DIFF 11:0 12:0
ENDDRIVER_INFO

keyword that starts the block
define the M1 layer (GDSII layer:datatype or just layer)
define the CONTACT layer
define the diffusion layer(s)
keyword to end the block