Not all wafer maps have well defined names. Very often users simply refer to "map" file which really does not help in identifying the format. Below we define the map formats support for input by WaferMap Convert v2.0 and associate a name with each. We also provide a small sample which would enable one to identify where a file matches the format.
We call this ASY only because the sample files provided end in .asy. We don't know what machine generates these files and we did not receive any format documentation on this format. But it is simple enough to guess the various parameters.
Since no bin codes are defined in the header we assume that: F=FAIL, 1=PASS and M=REFERENCE
Header
Flat_Notch : Down Location of the flat or notch (0=bottom) Product A0000A Product (aka Device) ID Lot A200000 Wafer Lot Number Wafer 01 Wafer Number Date 2017-11-17 10:18 Date Probed (guessing) Number of good dies 13199 Good Die count Good die = Bin 1,Bin 1 Bin Code for Good Die Reference die = M reference die marked with bin code M Nlines: 145 number of rows in the array Ncols: 120 number of columns in the array
Map Section
The header is followed by the map.
...........................................FFFFFFFFFFFFFFF.................................... .....................................1111111111111111111111111................................ ...................................F111111111111111111111111111111............................ .................................F111111111111111111111111111111111111........................ ..............................F1111111111111111111111111111111111111111....................... ............................F11111111111111111111111111111111111111111111..................... ..........................11F111111111111111111111111111111111111111111111.................... ..........................111111111111111111111111111111111111111111111F11.................... ..........................1111111111111111111111111F1111111111111111111111....................
We call this EM(Map) because of the source of this map file along with the extension ".map" of the sample files. Again we found no "formal" name nor do we know what equipment (likely a prober) produced this output.
Based on examining the data we believe: .=NULL, 0=FAIL, 1=PASS, R=REFERENCE
WaferId: 811175905A2 wafer ID; likely includes LotID and Wafer ID Flat/Notch: Down location of flat or notch MaxXY: 179 214 number of columns/rows TotDie: 26809 total die (not including NULL) Tested: 26809 number of die tested Pickable: 23789 number of die that can be picked ....................................................................000000000000000000000000 .................................................................000000000000000000000000000 ..............................................................000000000000000000000000000000 ............................................................00000000000000000000000000100001 ..........................................................0000000000010000000000000000001011 ........................................................000000000000000110010000111110100001 ......................................................00000000001011100101111111111111011110 ....................................................0000000001100111000101111111111111101111 ...................................................00000000101100111111111111111111111111111 .................................................0000000R11011111101111111111110110111111111 ................................................00000011000111011101111111111111111111111111
Notice that there is no stepping information or wafer diameter information in this format. Such data will have to be obtained separately and can be entered into WaferMap Convert's dialog to produce a more useful output map file.
This is an XML format (identified as IBIS.).
<?xml version="1.0"?> <IBIS_WAFER_DATA> identifies as an IBIS wafer data <HEADER> start of header section <WAFER_OCR_ID>TESTW07F1</WAFER_OCR_ID> wafer ID - OCR readable on wafer/frame <WAFER_BATCH_ID>TEST</WAFER_BATCH_ID> <WAFER>07</WAFER> wafer number <PRODUCT>TYPE1</PRODUCT> product ID <DEVICE>DEVICE1</DEVICE> Device identification <XSTEP>1.153000</XSTEP> X stepping (units in mm??) <YSTEP>1.153000</YSTEP> Y stepping (units in mm??) <FLAT_LOCATION>90</FLAT_LOCATION> flat is on left side <FLAT_TYPE>N</FLAT_TYPE> guessing that N = notch <XREF></XREF> don't know <YREF></YREF> don't know <XDELTA>0</XDELTA> don't know <YDELTA>0</YDELTA> don't know <PRQUAD>1</PRQUAD> probe quad start <COQUAD>1</COQUAD> coordinate quad reference <DATE>11-10-2016</DATE> <TIME>12:01:00</TIME> <DIFF_CTR_ABR>XXX</DIFF_CTR_ABR> don't know <PROBER>MAPWIZARD_1.7.1.1</PROBER> prober/software used to generate <CEPT_12NC>NO_CEPT</CEPT_12NC> don't know <SLDI_12NC>NO_SLDI</SLDI_12NC> don't know <FIRST_DIE>29,33</FIRST_DIE> array position of first die probed? <XOFFSET>143</XOFFSET> don't know <YOFFSET>33</YOFFSET> don't know <BIN_COUNT_PASS>19634</BIN_COUNT_PASS> count of die that passed <WAFER_SIZE>200</WAFER_SIZE> wafer diameter <WAFER_UNIT>MMT</WAFER_UNIT> units of wafer <BIN_CODE PASS="1" PASS_2="2" OTP="3" IREF="*" OPTICAL_PASS="?" UGLYDIE="/" EDGEDIE="-" SKIPDIE=":" BIN206="?" BIN205="?" bin53="]" BIN59="?" OPTIREJ=";" OUTSIDE="." > </BIN_CODE> <COLUMN_COUNT>171</COLUMN_COUNT> number of columns in the matrix <ROW_COUNT>171</ROW_COUNT> number of rows in the matrix <DIE_SPACING_CX>0</DIE_SPACING_CX> don't know - street? <DIE_SPACING_CY>0</DIE_SPACING_CY> don't know - street? </HEADER>
After the header section comes the XML markup:
<WAFER_MAP>
which is followed by an continuous "stream" of ASCII bin codes with no spacing. It is the responsibility of the reading software to break these into chunks of 171 codes per row since that is the declared row width.
the stream of bin ID's is terminated with:
</WAFER_MAP> </IBIS_WAFER_DATA>
The stream of bin ID's sums to 29,241 characters so this matches the array size of 171 x 171.
STIF was created by ST Microelectronics. This map file is complete -- one has both the geometric information needed and the map data. The bin codes are defined in the STIF documentation.
WM - V1.3 - STMicroelectronics Wafer Map File LOT G709059 Lot ID WAFER 01 Wafer ID PRODUCT DA00000-02 Device or Product ID READER G70000 XSTEP 648 UNITS (0.1)MIL X Step Size YSTEP 540 UNITS (0.1)MIL Y Step Size FLAT 180 Flat Orientation XREF -9737 UNITS (0.1)MIL distance from ref die to wafer center YREF -36630 UNITS (0.1)MIL distance from ref die to wafer center XBE TARG1 67 target1 X YBE TARG1 26 target1 Y XBE TARG2 128 target2 X YBE TARG2 137 target2 Y TARGBC 125 bin code (ASCII) for target XFRST 67 ref die location X YFRST 26 ref die location Y PRQUAD 2 probe quadrant (UL) COQUAD 2 coordinate quadrant (UL) DIAM 7874 wafer diameter in mils? XSTRP 22 first die in array X (wrt UL) YSTRP 22 first die in array Y (wrt UL) NULBC 126 NULL Bin (ascii 126) GOODS 12195 number of good die DATE 2017-00-00 TIME 09:00:00 RPSEL 0 SETUP FILE 11111B TEST SYSTEM TEST PROG 11111BB OLIFORMAT SORTNET OLIPATH \\archive$\eg_root\lots\LOT1\xref.waf OPERATOR joe blow PROBE CARD PROBER S01 MERGEDATE 2017-00-00 MERGETIME 12:00:00 WMXDIM=121 number of columns in array WMYDIM=145 number of rows in array ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzzzzzzz~~~~~~~~~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzzzzzzzzzzzzzzzzz~~~~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzz¡¡¡¡¡¡¡¡¡¡¡zzzzzzzzzz~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzzz~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz}¡¡¡¡¡¡¡¡¡¡¡&¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzz~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzz~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzz~~~~~~~
This one digit format was developed for a die mount machine that requires this format.
This format has no header.
Bin codes:
0 - Fail 1 - Pass R - Reference . - null or skip
Sample 1DIGIT Map File
....................................................000000000000000..................................................... ...............................................1111111111111100000000000................................................ ............................................1111111111111111111111111111010............................................. .........................................0111111001111111111111111111111111111.......................................... .......................................11111111111111111111111111111111111111111........................................ .....................................111111111111111111111111111111111111111111111...................................... ....................................111110111111111111111111111110111111111111111111.................................... ....................................111111111111111111111111111111111111111111111111.................................... ....................................R1111111111111111111111111111111111111111111111R.................................... ..............................11111111111111111111111111111111111111111111110111111111110............................... .............................1111111111111111111111111111111111111111111111111111111111111.............................. ...........................11111111111111111111111111111111111111111111111111111111111111110............................ ..........................1111111111111111111011111111111111111111111111111111111111111111111........................... .........................111111111111111111111111111111111111111111111111111111111111111111111.......................... ........................00111111111111111111111111111111111111111111111111111111111111111111111......................... .......................1111111111111111111111111111111111111111111111111111111111111111111111111........................