Once a wafer is completed, it is normally probed to determine which die on it pass and which die fail. This information, along with some reference die is output as a wafer map.
An optical inspection test (AOI) may also be made on each die in the wafer. The AOI machine may read in a map file in order to know which die to inspect and it can write out a map file to report on the inspection results.
After the wafer is tested, it is sliced up and the individual (singulated) die are arrayed on a sticky plastic membrane. A pick and place machine or a die attach machine then uses the map file from the prober (or the AOI) to select good die and place them in "bins" or perhaps the good die are directly attached to an package.
In any event, for this process to work, the map file produced by the probing machine must be read by the die pick-and-place equipment or die attach equipment.
Data Flow from Probe to Die Attach
What we have attempted to do here is to catalog as many probers, AOI machines, pick-and-place and die attach machines in use and to identify (when possible) the map file formats that these machines read and write.
| WAFER PROBERS | |||
| MANUFACTURER | MODEL | FORMAT | COMMENTS |
| Accretech/Tokyo Seimitsu | UF-3000EX (300 mm) | A-PM-90A | Binary proprietary format. |
UF-2000 (200 mm) | A-PM-90A | Binary proprietary format. |
| FormFactor (ex Cascade) | Summit 200 (200 mm) | We have an example file but no documentation | PA 200 (200 mm) | PA | ASCII |
| Electroglas | EG6000 (300 mm) | SECS II | Binary; English units 10E-6 (0.1 mil) | EG-4090 (200 mm) | SECS II | Binary; English units 10E-6 (0.1 mil) |
| MJC Micronics Japan Co., Ltd. | PW-8000, (8 in) | Unknown | AP-80 (8 in) | Unknown | BP-3000 (12 in) | Unknown |
| SEMICS | OPUS3 (300 mm) | Unknown | sent email to both SEMICS and US Rep 07/31/2018; No response
They have an office in Austin Tel: (512) 305.3789 left message 01/25/24 |
| Tokyo Electron Ltd. (TEL). | P8 (200 mm) | Unknown | Binary | P12 (300 mm) | Unknown | Binary | Precio | Unknown | Binary |
| DIE ATTACH, PICK-AND-PLACE | |||
| MANUFACTURER | MODEL | FORMAT | COMMENTS |
| 3S Silicon Tech (Taiwan) | Pick & Place | Unknown | Sent Request for Info on August 6, 2018 |
| ASM Pacific | AD 830 | Unknown | |
| Capcon Ltd. | COW Die Bonder 2060W | Unknown | Sent Request for Info on August 6, 2018 |
| ESEC (Besi) | Esec 2100 | Unknown | Sent request for information August 7, 2018 |
| MicroAssembly Technologies | MAT 6400 | Unknown | |
| Royce Instruments | MP 300 | Unknown | |
| AP+ | Unknown | ||
Kulicke & Soffa https://www.kns.com/Products/Equipment/Die-Attach APAMA DA AD 898 AD8912 (acquired Alphasem in 2006) Alphasem 9006 Synax S9 SX2400