Wafer maps are used in the back end of the IC manufacturing process to annotate the die on a wafer - the annotation may indicate whether the die is good or bad, the "grade" of the device or whether this device is a reference device.
WMapEdit (Wafer Map Editor) enables an engineer to view, edit and convert wafer maps from one format to another.
Figure 1: WMapEdit displaying a STIF wafer map. The program enables the user to pan and zoom. Placing the cursor over a device provides a readout of the physical location, the array position and the bin code.
Additional input and output formats will be added as our customers request them.
WmapEdit uses the WMapConvert conversion engine for reading and writing map files. When an enhancement is added to WMapConvert, WMapEdit is easily updated to support the new formats.
The user can pan and zoom to examine small sections of the wafer map. This is especially helpful for small die where a single wafer may have 10,000 devices on it.
User can set the color of each bin code in order to more clearly display the wafer's yield pattern.
WmapEdit enables the user to apply a rotational transformation. This is useful when the data is presented with the wafer flat in one orientation but the target machine requires a different orientation.
The user can modify the bin code of any device. Useful when an incoming wafer map does not identify a reference device correctly.
The user can import one format and then convert and export to a different format.
Need to generate a map from scratch to exclude edge and ugly die? With the newMap Synthesizer you can generate one in a few seconds and save a lot of programming time on your die bonder.
Various Map formats use different terms for parameters and measurements. Out glossary of terms provides some details on terms used and can help when converting from one format to another.