For a variety of purposes, package designers would like to take a stack of Gerber files (or an ODB++ file), and identify and extract all of the metal associated with a particular net or group of nets. Members of the net should be generated by detecting touching or overlapping conductors and vias to build connectivity. Gerber/ODB++ file sets routinely have multiple layers of metal; metal layers are interconnected vertically by vias; small "openings" in the dielectric between the metal layers.

3D view of package nets

Artwork's NETEX-G program uses Boolean operations to merge connected traces, flashes and polygons into an "electrically" connected set. In addition to the actual Gerber file, NETEX-G requires a technology file that defines the "stackup" i.e. the conductors and vias.

NETEX-G is extremely fast because Artwork is using advanced algorithms developed for the IC world where file sizes are two orders of magnitude larger.

OEM Library Version

OEM partners who wish to incorporate NETEX-G's functionality into their own programs (to support import of Gerber/ODB++ data files) can take advantage of the library version of NETEX-G. Special support is supplied to such partners. Contact Artwork for more details.


Application Notes

  Netlist Output  

Describes how to extract a netlist from an IC package design (flip chip). The pin labels are imported from an AIF file.

  Converting Gerber to Ansoft HFSS via DXF  

Converting Gerber to clean DXF for import into Ansys/Ansoft HFSS. Includes support for top and bottom solder mask layers. Video 05:23 mm:ss


Revision History

Example Files