Artwork has developed a plug-in using the Xynetix Navigator backplane. This allows the user to create an AIF file directly from Encore. To generate the AIF file use the Outputs pulldown and select AIF Out.

Selecting Export AIF ... will open a tabbed dialog box. There are three sections to the dialog box: Nets, Components and Layers. The user needs to specify certain information that bondgen may not be able to determine automatically.

Net Power/Ground

The user needs to specify which net or nets are power and ground nets. This is used by bondgen to provide the list of balls attached to power/ground required in the document package and to extract ground ring entities (rings can be built from many entity types but must be a member of your selected nets....)


Normally AIFOUT can detect which component is the die and which component is the BGA package. However it is possible to develop a complex BGA where there might be some ambiguity. In that case the use can override with the checkboxes the choice made automatically by AIF Out.


Normally AIFOUT can use the padstack's property to determine its function. However if the user has failed to properly assign properties to the stack AIF Out might make an incorrect choice. In that case the use can override the pad stack function with the checkboxes.


Some Encore designs can be very complex and have entities on many layers.The user needs to specify which layer holds the wires, fingers and land pads.This helps AIF Out select the correct entities. especially for multi-layer designs.

Writing the AIF File

You can select the directory and the filename for your AIF file. The file is a simple ASCII file and can be moved across UNIX/Windows machines and across networks without problems. Hit OK when you are ready to write the output.

Minimum Design Requirements

AIFOUT searches the Encore database for certain items; if not present, an AIF file cannot be created. Some older designs imported from Encore 2.0 may not be constructed in a way that the AIFOUT module can build a file. The requirements for the design database include:

  • Two Components
      There must be at least two components: a die and a package. AIF out was not intended to handle multiple die.

  • Die component
      Die pads are defined as pins in the die component. These pins should be labeled with integer numbers 1,2,3.... A square, round or rectangular padstack should be assigned to the pins.

  • BGA Component
      Land Pads (Balls) are defined as pins in this component. These pins should be labeled with the JEDEC assignment such as A1, F5, AA25. Pins should be assigned a round, square or rectangular padstack.

  • Bond Fingers
      Bond Fingers should be pins/vias with the attribute of bond finger. They cannot be pins inside of either the die or the bga component. They should be assigned to a padstack such as rectangle or oblong or round.

      When attaching to a ring, use a different pin/via/padstack that for regular bondfingers. Normally this is a circle/round of the same diameter as the wire.

      You should run the bond finger numbering routine and assign them integer labels i.e. 1,2,3,4........You need not actually display the finger label attributes.

  • Padstacks
      Padstacks used for fingers, die pads and lands should have the same geometry on all layers. i.e. if the padstack is defined as a .025 mm round on layer wirebond it should also be 0.025 mm round on layer M1.
  • Power and Ground Rings
      Power and ground rings are extracted on the following basis:

        They must be smart metal (area or trace) but not vias
        They must belong to the net you have assigned for power or ground
        They must lie on the layer you have selected for power/ground rings

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