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SINF

The SINF [Simplified Integrator Nested Format] spec consists of a header section followed by row data. It is a simplified subset of the INF results file from KLA Tencor. The basic structure is shown below:

Header


DEVICE:xxx        identification assigned by originator
LOT:xxx           identification assigned by originator
WAFER:xxx         identification assigned by originator
FNLOC:180         wafer flat position (0=TOP,90=RIGHT,180=BOT 270=LEFT)
ROWCT:62          number of rows
COLCT:63          number of columns
BCEQU:01          List of Bin Codes that are good die (comma or space delimited)
REFPX:            x-coord of reference die (optional)
REFPY:            y-coord of reference die (optional)
DUTMS:mm          die units of measurement (mm or mil)
DIECT:3405        the number of die in the map file (optional)
XDIES:2.945       step along X
YDIES:2.945       step along Y
COMMENT: sample   a string used to annotate the file (optional)

If the BCEQU: field is missing or blank, the default understanding is that die 01 is considered to be the PASS die.


Row Data

Following the header is row data. It is identified by the keyword RowData: Here are the various hex values one will find in the row data:

00-0A             good die (each die type gets its own unique identifier starting 
                  at 00, 01, 02 ...) reserve 0A for the die at wafer center.

0B-F0             bad die

__                no die (underscore-underscore) used as a placeholder in the matrix.

@@                uninspected die

FD-FE             edge die (optional)

FF                reference die (typically a die that is visually different)

Row data lines (for the HEX variant) look like this:


RowData: __ __ __ __ __ __ __ __ __ __ __ __ 01 01 01 01 __ __ __ __ __ 01 01 01 01 01
RowData: __ __ __ __ __ __ __ __ __ __ 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01
RowData: __ __ __ __ __ __ __ __ 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01
 

Reference Die

There are two ways of locating the reference die:

The coordinate system when REFPX: and REFPY: is used is shown below:

SINF reference die coordinate system

Note: Notice that the X and Y array index starts at 1,1; most other map files consider the starting position to be 0,0. Failing to note this could result in alignment off by 1 die in X and Y.




3 Digit SINF

We're calling this 3 Digit SINF since it looks very similar to SINF but has 3 digit bin ID's and three underscores to hold the empty positions. The header appears to be identical to SINF header.


RowData:___ ___ ___ ___ ___ ___ ___ ___ 000 000 000 000 000 000
RowData:___ ___ ___ 000 000 000 000 000 000 000 000 000 000 000
RowData:___ ___ 000 000 000 000 000 000 000 000 000 000 000 000
RowData:___ ___ 000 000 000 000 000 000 000 000 000 000 000 000 
RowData:___ ___ 000 000 000 000 000 000 000 000 000 000 

As you can see, instead of 00 they this sample uses 000 to ID each die. While we have no official spec for this variant of SINF, we assume that the range of values are from 000 to 255.

UPDATE MAY 22, 2019

Artwork has received information from a foundry and OSAT who use 3 Digit SINF of the following guidelines. However these guidelines are not necessarily formal standards; as you can see below they are not consistent between users of 3 digit SINF.

Tower Semiconductor (Foundry)

Bin CodeDescription
001-003PASS
004-253FAIL
253-254UGLY

Amkor Technology (OSAT)

Single SiteMulti-Site (> 2 die)
Bin CodeDescriptionBin CodeDescription
000PASS 001-200PASS
001-100FAIL 001-100FAIL