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Unisem

The map file documented here was received from Unisem in Malaysia but we don't know if the format was developed by Unisem or produced by some equipment that they use. We will refer to it as Unisem until we identify the source of the map file. If you use this format and have more information concerning the source software or equipment please contact steve@artwork.com

Header

We've annotated what we think the various parameters mean. This has a very limited header with no information about the wafer size, step size, product ID, origin location, reference die.


WaferId: CMG241-09-B3    the wafer ID
Orient: 3                notch orientation - however don't know what side 3 indicates
MaxXY: 87 91             likely the row/column count
TotDie: 1679             total die
Tested: 1679             tested die
Pickable: 1466           die marked as pickable (i.e. PASS)


Row Data

Following the header is row data.


....................................XXXXXXXXXXXXXX.....................................
..............................XXXXXXX121212121212XXXXX.................................
............................XXX1212121212121212121212XXXX..............................
..........................XXX121212121212121212121212121XXXX...........................
........................XXX12121212121212121212121212121212XXX.........................
......................XXX121212121212121212121212121212121212XXX.......................
....................XXX1212121212121212121212121212121212121211XXX.....................
...................XX12121212121212121212121212121212121212121212XXX...................
.................XXX21212121212121212121212121212121212121212121212XX..................
.............XX12121212121212121212121212121212121212121212121212121XXXX...............
............XX212121212121212121212121212121212121212121212121212121XXXXX..............
...........XX1212121212121212121212121212121212121212121212121212121RXXXXXX............

Notes

If we inspect the bin codes we can see that:

The number of rows and columns match up with the header. [ 87 x 91 ]

The "." code is for null die [1645 in this sample]

The "X" code seems to be for edge die [370 in this sample]

The "R" code seems to be a reference device [2 in this sample]


There are in addition the following bin codes:

"1" [2901 in this sample]
"2" [2887 in this sample]
"3" [0    in this sample]
"4" [0    in this sample]
"5" [14   in this sample]
"6" [71   in this sample]
"7" [13   in this sample]
"8" [14   in this sample]
"9" [0    in this sample]

These quantities do not match in any way with the header information so we believe the sample map file provided by Unisem does not represent a "real" wafer.