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Supported Wafer Map Formats

Not all wafer maps have well defined names. Very often users simply refer to "map" file which really does not help in identifying the format. Below we define the map formats support for input by WaferMap Convert v2.0 and associate a name with each. We also provide a small sample which would enable one to identify where a file matches the format.


Input Formats

ASY

We call this ASY only because the sample files provided end in .asy. We don't know what machine generates these files and we did not receive any format documentation on this format. But it is simple enough to guess the various parameters.

Since no bin codes are defined in the header we assume that: F=FAIL, 1=PASS and M=REFERENCE

Header

Flat_Notch  : Down                  Location of the flat or notch (0=bottom)
Product A0000A                      Product (aka Device) ID
Lot A200000                         Wafer Lot Number                
Wafer 01                            Wafer Number
Date 2017-11-17 10:18               Date Probed (guessing)
Number of good dies 13199           Good Die count
Good die = Bin 1,Bin 1              Bin Code for Good Die
Reference die = M                   reference die marked with bin code M
Nlines: 145                         number of rows in the array
Ncols: 120                          number of columns in the array

Map Section

The header is followed by the map.

...........................................FFFFFFFFFFFFFFF....................................
.....................................1111111111111111111111111................................
...................................F111111111111111111111111111111............................
.................................F111111111111111111111111111111111111........................
..............................F1111111111111111111111111111111111111111.......................
............................F11111111111111111111111111111111111111111111.....................
..........................11F111111111111111111111111111111111111111111111....................
..........................111111111111111111111111111111111111111111111F11....................
..........................1111111111111111111111111F1111111111111111111111....................



EM(Map)

We call this EM(Map) because of the source of this map file along with the extension ".map" of the sample files. Again we found no "formal" name nor do we know what equipment (likely a prober) produced this output.

Based on examining the data we believe: .=NULL, 0=FAIL, 1=PASS, R=REFERENCE


WaferId: 811175905A2                           wafer ID; likely includes LotID and Wafer ID
Flat/Notch: Down                               location of flat or notch
MaxXY: 179 214                                 number of columns/rows
TotDie: 26809                                  total die (not including NULL)
Tested: 26809                                  number of die tested
Pickable: 23789                                number of die that can be picked


....................................................................000000000000000000000000
.................................................................000000000000000000000000000
..............................................................000000000000000000000000000000
............................................................00000000000000000000000000100001
..........................................................0000000000010000000000000000001011
........................................................000000000000000110010000111110100001
......................................................00000000001011100101111111111111011110
....................................................0000000001100111000101111111111111101111
...................................................00000000101100111111111111111111111111111
.................................................0000000R11011111101111111111110110111111111
................................................00000011000111011101111111111111111111111111

Notice that there is no stepping information or wafer diameter information in this format. Such data will have to be obtained separately and can be entered into WaferMap Convert's dialog to produce a more useful output map file.




IBIS

This is an XML format (identified as IBIS.).


<?xml version="1.0"?>                           
<IBIS_WAFER_DATA>                                      identifies as an IBIS wafer data
<HEADER>                                               start of header section
<WAFER_OCR_ID>TESTW07F1</WAFER_OCR_ID>                 wafer ID - OCR readable on wafer/frame
<WAFER_BATCH_ID>TEST</WAFER_BATCH_ID>                 
<WAFER>07</WAFER>                                      wafer number 
<PRODUCT>TYPE1</PRODUCT>                               product ID 
<DEVICE>DEVICE1</DEVICE>                               Device identification
<XSTEP>1.153000</XSTEP>                                X stepping (units in mm??)
<YSTEP>1.153000</YSTEP>                                Y stepping (units in mm??)
<FLAT_LOCATION>90</FLAT_LOCATION>                      flat is on left side
<FLAT_TYPE>N</FLAT_TYPE>                               guessing that N = notch
<XREF></XREF>                                          don't know
<YREF></YREF>                                          don't know
<XDELTA>0</XDELTA>                                     don't know
<YDELTA>0</YDELTA>                                     don't know
<PRQUAD>1</PRQUAD>                                     probe quad start
<COQUAD>1</COQUAD>                                     coordinate quad reference
<DATE>11-10-2016</DATE>
<TIME>12:01:00</TIME>
<DIFF_CTR_ABR>XXX</DIFF_CTR_ABR>                      don't know
<PROBER>MAPWIZARD_1.7.1.1</PROBER>                    prober/software used to generate
<CEPT_12NC>NO_CEPT</CEPT_12NC>                        don't know
<SLDI_12NC>NO_SLDI</SLDI_12NC>                        don't know
<FIRST_DIE>29,33</FIRST_DIE>                          array position of first die probed?
<XOFFSET>143</XOFFSET>                                don't know
<YOFFSET>33</YOFFSET>                                 don't know
<BIN_COUNT_PASS>19634</BIN_COUNT_PASS>                count of die that passed
<WAFER_SIZE>200</WAFER_SIZE>                          wafer diameter
<WAFER_UNIT>MMT</WAFER_UNIT>                          units of wafer
<BIN_CODE  
 PASS="1" 
 PASS_2="2" 
 OTP="3" 
 IREF="*"       
 OPTICAL_PASS="?" 
 UGLYDIE="/" 
 EDGEDIE="-"                  
 SKIPDIE=":" 
 BIN206="?" 
 BIN205="?" 
 bin53="]" 
 BIN59="?" 
OPTIREJ=";" 
OUTSIDE="." 
>
</BIN_CODE>
<COLUMN_COUNT>171</COLUMN_COUNT>                      number of columns in the matrix
<ROW_COUNT>171</ROW_COUNT>                            number of rows in the matrix
<DIE_SPACING_CX>0</DIE_SPACING_CX>                    don't know - street?
<DIE_SPACING_CY>0</DIE_SPACING_CY>                    don't know - street?
</HEADER>

After the header section comes the XML markup:

<WAFER_MAP>

which is followed by an continuous "stream" of ASCII bin codes with no spacing. It is the responsibility of the reading software to break these into chunks of 171 codes per row since that is the declared row width.

the stream of bin ID's is terminated with:

</WAFER_MAP>
</IBIS_WAFER_DATA>

The stream of bin ID's sums to 29,241 characters so this matches the array size of 171 x 171.




STIF

STIF was created by ST Microelectronics. This map file is complete -- one has both the geometric information needed and the map data. The bin codes are defined in the STIF documentation.


WM - V1.3 - STMicroelectronics Wafer Map File

LOT G709059                         Lot ID
WAFER 01                            Wafer ID
PRODUCT DA00000-02                  Device or Product ID
READER G70000
XSTEP 648 UNITS (0.1)MIL            X Step Size
YSTEP 540 UNITS (0.1)MIL            Y Step Size
FLAT 180                            Flat Orientation
XREF -9737  UNITS (0.1)MIL          distance from ref die to wafer center 
YREF -36630 UNITS (0.1)MIL          distance from ref die to wafer center 
XBE TARG1 67                        target1 X
YBE TARG1 26                        target1 Y 
XBE TARG2 128                       target2 X
YBE TARG2 137                       target2 Y
TARGBC 125                          bin code (ASCII) for target
XFRST 67                            ref die location X
YFRST 26                            ref die location Y
PRQUAD 2                            probe quadrant (UL)
COQUAD 2                            coordinate quadrant (UL)
DIAM 7874                           wafer diameter in mils?
XSTRP 22                            first die in array X (wrt UL)
YSTRP 22                            first die in array Y (wrt UL)
NULBC 126                           NULL Bin (ascii 126)
GOODS 12195                         number of good die
DATE 2017-00-00
TIME 09:00:00
RPSEL 0
SETUP FILE 11111B
TEST SYSTEM	
TEST PROG 11111BB
OLIFORMAT SORTNET
OLIPATH	\\archive$\eg_root\lots\LOT1\xref.waf
OPERATOR joe blow
PROBE CARD	
PROBER S01
MERGEDATE 2017-00-00
MERGETIME 12:00:00

WMXDIM=121                          number of columns in array
WMYDIM=145                          number of rows in array

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzzzzzzz~~~~~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzzzzzzzzzzzzzzzzz~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzzzzz¡¡¡¡¡¡¡¡¡¡¡zzzzzzzzzz~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzzz~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz}¡¡¡¡¡¡¡¡¡¡¡&¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzz~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzzz~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~zzzzz¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡zzzzz~~~~~~~


Output Formats

1DIGIT

This one digit format was developed for a die mount machine that requires this format.

This format has no header.

Bin codes:

0 - Fail
1 - Pass
R - Reference
. - null or skip

Sample 1DIGIT Map File

....................................................000000000000000.....................................................
...............................................1111111111111100000000000................................................
............................................1111111111111111111111111111010.............................................
.........................................0111111001111111111111111111111111111..........................................
.......................................11111111111111111111111111111111111111111........................................
.....................................111111111111111111111111111111111111111111111......................................
....................................111110111111111111111111111110111111111111111111....................................
....................................111111111111111111111111111111111111111111111111....................................
....................................R1111111111111111111111111111111111111111111111R....................................
..............................11111111111111111111111111111111111111111111110111111111110...............................
.............................1111111111111111111111111111111111111111111111111111111111111..............................
...........................11111111111111111111111111111111111111111111111111111111111111110............................
..........................1111111111111111111011111111111111111111111111111111111111111111111...........................
.........................111111111111111111111111111111111111111111111111111111111111111111111..........................
........................00111111111111111111111111111111111111111111111111111111111111111111111.........................
.......................1111111111111111111111111111111111111111111111111111111111111111111111111........................





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