Once 2D package design data has been extracted into the 3DI format, 3DVU takes over.

Once inside the window the user can pan, orbit and zoom in/out. By "flying" through the wires at close range problems with wire tier interaction (which are not checked by APD's DRC) can be easily seen. The designer can also see if the spacer gap is sufficient to allow clearance of wires below a top level die body.

      2D view of stacked die package.

3D view of stacked die package from APD-3D's viewer. Only wires and bond fingers (vias) were selected.

Zoomed in view shows the advanced wire model used for the longer wires.