Wafer Diameter/Margin/Notch
Step & Repeat Parameters
Dealing with Reticle Data
Knock Out Die to Reveal Underlying Features
Drop in Alignment and Test Die
Leaving Sacrificial Die for Clipping
Creating a SINF output File
Clip Array to a Round Circle
Removing Slivers during Clip
Merging Data from External Files
Final Mask Set Output
Viewing and Checking Results
Auto Documentation of Unit Cell
Auto Documentation of Wafer Layout
Video - Multi Product Wafer in 10 minutes
