Wafer Level Mask Tools Page Header



Removing Slivers from the Clipped Output





Contents

Wafer Diameter/Margin/Notch

Step & Repeat Parameters

Dealing with Reticle Data

Knock Out Die to Reveal Underlying Features

Drop in Alignment and Test Die

Leaving Sacrificial Die for Clipping

Creating a SINF output File

 

Clip Array to a Round Circle

Removing Slivers during Clip

Merging Data from External Files

Final Mask Set Output

Viewing and Checking Results

Auto Documentation of Unit Cell

Auto Documentation of Wafer Layout

Video - Multi Product Wafer in 10 minutes